TMTB · #market-chatter · 每日精读

AI 硬件上游迎量价齐升,CCL 与 ABF 载板产能吃紧倒计时

沉寂 2026-06-20 周六 (ET) · 主帖 1 / 回复 1 · 生成 2026-06-22
机密 —— 私密会员制 Slack,未核实群聊、署名为化名。非投资建议,勿公开/收录。悬停 [n] 看原贴中文译文。
今日要点
  1. CCL 升级单机架价值量飙升,建滔积层板 2026 年 ASP 预期大涨 84%
  2. PCB 设备中国大厂近千亿 Capex 落地,微钻头迎 3-4 倍 ASP 提升
  3. ABF 载板芯片尺寸激增致 2027 年利用率破百,Unimicron/Ibiden 占优

1 AI 硬件上游:材料与设备迎量价双击

CCL 与 PCB 设备 多·上游材料设备

AI 驱动单机架价值量跨越式增长,上游材料与耗材迎量价双击 内容量从 H100 的数千美元飙升至 Rubin 的数万美元[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"

  • 建滔 (1888 HK) 提价: 6月 CCL 与半固化片 ASP 提价 15%(年初已涨 10%)。预期 2026 年 CCL ASP 将同比大涨 84% 至约 HK$230/张,现货价或从 25年底 Rmb150 升至 26年底 Rmb270[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • M9 成为主引擎: JPM 数据显示,M9 级 CCL TAM 将从 2025 年 US$1.59B 翻倍至 2027 年 US$6.48B,M7 及以下产品边缘化[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • PCB 设备 Capex 拐点: 中国头部 6 家厂商 24-26 年承诺近 CNY98B 资本开支。考虑 12-18 个月滞后期,将转化为 26-27 年强劲的设备交付潮[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • 微钻头 (Dtech) 升级: AI PCB 推动高端微孔钻头需求,ASP 达标准钻头 3-4 倍(CNY2.70 vs 0.74)。高层数/细线路使容错率极低,耗材龙头定价权显现[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"

对 PM 来说 = 关注未计入 NVDA 认证的预期差 建滔目前模型尚未计入 NVDA 资格认证,且铜箔通胀将直接推升其估值[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"

ABF 载板与玻璃基 多·载板

芯片面积激增致物理缩放遇阻,2027年产能利用率将破 100% 客户或将签订 LTA 以锁定产能[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"

  • 尺寸膨胀加剧紧缺: NVDA Hopper 总面积约 38,280mm² Blackwell 82,782mm² Rubin 144,918mm² Feynman 激增至 432,000mm²(24层)[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • 产能利用率飙升: 行业利用率将从 2024 年约 65% 升至 2026 年 90%,2027 年突破 100%。Ibiden 的 Gama 和 Ono 工厂超 70% 资本开支由 NVDA 和 Intel 提供资金[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • T-glass 成核心壁垒: Unimicron 占据 35-40% 的 T-glass 份额,Ibiden 占 30-35%。若 T-glass 供应紧张,赢家不仅需具备载板产能,更需锁定上游玻璃基分配[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"
  • Ibiden 客户结构优化: NVDA 占比降至 49%,AMD 15%,Intel EMIB 14%。若 MTK 接手 TPU v9 并采用 EMIB-T 封装,将为 Ibiden 27-28 年贡献显著增量[1]Terminal Junkie · 06-20"Random Thoughts: 1. If anyone has been following me, you guys will know that I’ve been a big advocate for CCL, PCB, subs…"