NuttyCLD

X · 40 atoms · 2026-06-23 → 2026-06-26 · 信用档先验 cred3

🟦 fact 25 · 🟥 take 15 · stance ▲9/▼1/◆4

覆盖实体 (top 10)

• MU — 19 atoms
• Intel — 7 atoms
• TSMC(TSM) — 2 atoms
• SemiAnalysis — 2 atoms
• Intel(INTC) — 1 atoms
• EMIB — 1 atoms
• EMIB-T — 1 atoms
• CoWoS — 1 atoms
• TSM — 1 atoms
• HBM4 — 1 atoms

话题分布 (top 8)

毛利率 (4) · 封装竞争 (3) · 封装技术 (2) · 覆盖比例 (2) · 履约义务 (2) · 数据中心营收 (2) · 产能突破 (1) · 管理层表态 (1)

样例 atoms

• 2026-06-23 · Intel · Standard EMIB had power routing around the bridge in a cantilevered path, which introduced droop. EMIB-T runs power straight down through the bridge from the substrate to the chip.
• 2026-06-23 · Intel · Lee wasn't brought in next to the yield problem. He was brought in to solve it. And nothing signals a company's direction more clearly than who it trusts with the hardest part. So
• 2026-06-23 · TSMC(TSM) · TSMC($TSM) sits on the logic, the packaging, and the HBM base die
• 2026-06-23 · TSMC(TSM) · That stack of three is the "bundle", and the bundle is the moat
• 2026-06-23 · EMIB · EMIB는 사실 2014년부터 있었지만 GPU-HBM 연결에선 CoWoS-S에 밀렸습니다.

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