dnystedt

X · 74 atoms · 2026-06-22 → 2026-06-29 · 信用档先验 cred5

🟦 fact 54 · 🟥 take 20 · stance ▲8/▼6/◆6

覆盖实体 (top 10)

• TSM — 16 atoms
• ASE — 8 atoms
• 台湾PCB产业 — 5 atoms
• semiconductor market — 5 atoms
• Asustek Computer — 3 atoms
• SK Hynix — 3 atoms
• Sigurd Microelectronics — 3 atoms
• QCOM — 3 atoms
• Taiwan export orders — 2 atoms
• Samsung — 2 atoms

话题分布 (top 8)

资本支出 (4) · 先进制程 (3) · 产能扩张 (3) · 先进封装 (3) · SerDes方案 (2) · 管理层表态 (2) · 定价权 (2) · 供应链 (2)

样例 atoms

• 2026-06-24 · ASE · ASE’s advanced semiconductor packaging & testing revenue will double this year amid severe capacity shortages due to AI-related orders
• 2026-06-22 · MediaTek · MediaTek won primary orders for Google’s TPU v9 chips by delivering a custom 336G SerDes solution after Broadcom’s more ambitious 448G SerDes missed the production timeline
• 2026-06-22 · Google TPU v9 · Google had originally planned to adopt 448G but switched to a 336G transitional spec due to signal integrity, power, and thermal challenges
• 2026-06-22 · 448G光模块DSP · The DSP required for 448G optical modules may need a 2nm process, delaying volume production until 2028–2029
• 2026-06-23 · TSMC · TSMC is raising prices 5% - 10% on all leading-edge 7nm and below chip manufacturing processes (N7/5/4/3/2 etc.)

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