TSMC CoPoS

6 atoms · 跨 4 天 · 首见 2026-06-12 · 最近 2026-07-01

三色: 🟦 fact 3 · 🟥 take 3 · stance ▲3/▼0/◆2

来源: X 6

时态: fresh:5 · aging:1

标签: 好数字:3 · 好观点:3 · 好思考:2 · 好信源:2

预测 (forecast) (3)

• 2026-06-15 ⭐ · 商业化时间线
  TSMC’s CoPoS timeline likely remains 2028 for commercialization, since the earliest the tech will be ready is 2027
  tags: 好数字·好信源 · → daily
  value: date=2028
• 2026-07-01 · max package area target (vs Intel)
  TSMC targets 14x reticle by 2029 against Intel's 12x, so on absolute max package area the panel approaches edges it at the very top end
  tags: 好数字·好思考 · → daily
  value: approx_qty=14x reticle vs 12x
• 2026-06-12 · 利用率预期
  CoPoS replaces traditional round glass carrier with a square panel format, pushing utilization rates above 75%.
  tags: 好数字·好观点 · → daily
  value: qty=>75% · date=2026-06-12

立场 (position) (1)

• 2026-06-12 [老化中] · 技术路线发展
  TSMC's #CoPoS is moving fast, and the opportunities for Taiwan suppliers are taking shape.
  tags: 好观点·好思考 · → daily

事实 (fact) (2)

• 2026-06-29 · 开发状态
  TSMCはCoPoSを開発するために、この表にある装置をVisEra Technologies（採鈺科技）の龍潭工場に設置して評価しているらしい。
  tags: 好信源 · → daily
• 2026-06-15 · 正在加速推进
  TSMC is moving faster on CoPoS due to pressure from Samsung’s head start on panel-level packaging
  tags: 好观点 · → daily
  value: direction=加速

时间轴 (近 20)

• 2026-07-01 · forecast · max package area target (vs Intel) · → daily
• 2026-06-29 · fact · 开发状态 · → daily
• 2026-06-15 · forecast · 商业化时间线 · → daily
• 2026-06-15 · fact · 正在加速推进 · → daily
• 2026-06-12 · forecast · 利用率预期 · → daily
• 2026-06-12 · position · 技术路线发展 · → daily

← 实体目录 · 系统日志