以下部分引用 AI 总结，现阶段 AI 仍然有幻觉。请以内容的原文为准。
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HUAWEI
10 atoms · 跨 4 天 · 首见 2026-04-29 · 最近 2026-06-11
三色: 🟦 fact 7 · 🟥 take 3 · stance ▲6/▼0/◆3
来源: X 10
时态: fresh:9 · stale:1
标签: 好信源:6 · 好观点:3 · 好思考:3 · 好数字:2 · 好问题:1
叙事 (narrative) (2)
- 2026-05-25 · Layered stacking of dies
If I stack 5 x 50 MTr/mm2 dies on top of each other, do I get 250 MTr/mm2 too?
tags: 好问题·好思考 · → daily
- 2026-05-25 · six years of persistent hard-work will finally pay off
Six years of persistent hard-work will finally pay off.
tags: 好观点 · → daily
预测 (forecast) (2)
- 2026-05-25 ⭐ · 高制程芯片预期晶体管密度
HUAWEI's high-end chips are now expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes by 2031
tags: 好数字·好信源 · → daily
value: qty=14 Å (1.4 nm) 等效 · date=2031
- 2026-05-24 · high-end chips by 2031 transistor density equivalent to 14 Å (1.4 nm) processes
By 2031, HUAWEI's high-end chips based on this law are expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes.
tags: 好数字·好信源 · → daily
value: date=2031 · direction=equivalent
立场 (position) (1)
展开 1 条老旧 / 已过期
- 2026-05-25
[老旧] · 半导体可持续发展演进路径
HUAWEI's He Tingbo presents a sustainable evolutionary path for semiconductors enabled by shifting from geometric to time scaling, delivering benefits across the industry as a whole.
tags: 好观点 · → daily
value: date=2026-05-25 · direction=positive
事实 (fact) (5)
- 2026-05-25 · LogicFolding evolved circuit architecture from planar to vertical layered structure
Through LogicFolding, Huawei has evolved the circuit architecture from a traditional planar layout to a vertical, layered structure — analogous to the vertical stacking seen in 3D NAND.
tags: 好信源·好思考 · → daily
- 2026-05-24 · presented Tau (τ) Scaling Law
HUAWEI has presented the Tau (τ) Scaling Law, a new principle for guiding the future development of the semiconductor industry.
tags: 好信源·好思考 · → daily
value: date=2026-05-25
- 2026-05-24 · Kirin smartphone chip performance improvement
HUAWEI: THE KIRIN SMARTPHONE CHIP TO BE LAUNCHED THIS FALL WILL SEE A SIGNIFICANT PERFORMANCE IMPROVEMENT. (PEOPLE’S DAILY)
tags: 好信源 · → daily
- 2026-06-11 · 成功完成DeepSeek模型事後学習
ファーウェイ半導体、DeepSeekの「事後学習」に初成功
tags: 好信源 · → daily
- 2026-04-29 · 芯片订单需求
BIG CHINESE TECH FIRMS RUSH TO SECURE ORDERS FOR HUAWEI CHIPS AFTER DEEPSEEK PREVIEW - SOURCES
tags: 好观点 · → daily
value: qty=增加 · date=2026-04-29
时间轴 (近 20)
- 2026-06-11 ·
fact · 成功完成DeepSeek模型事後学習 · → daily
- 2026-05-25 ·
fact · LogicFolding evolved circuit architecture from planar to ver · → daily
- 2026-05-25 ·
narrative · six years of persistent hard-work will finally pay off · → daily
- 2026-05-25 ·
narrative · Layered stacking of dies · → daily
- 2026-05-25 ·
position · 半导体可持续发展演进路径 · → daily
- 2026-05-25 ·
forecast · 高制程芯片预期晶体管密度 · → daily
- 2026-05-24 ·
fact · Kirin smartphone chip performance improvement · → daily
- 2026-05-24 ·
fact · presented Tau (τ) Scaling Law · → daily
- 2026-05-24 ·
forecast · high-end chips by 2031 transistor density equivalent to 14 Å · → daily
- 2026-04-29 ·
fact · 芯片订单需求 · → daily
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