EMIB-T

16 atoms · 跨 6 天 · 首见 2026-05-26 · 最近 2026-07-01

三色: 🟦 fact 12 · 🟥 take 4 · stance ▲7/▼1/◆4

来源: X 16

时态: fresh:15 · stale:1

标签: 好思考:6 · 好观点:4 · 好数字:4 · 好信源:4

叙事 (narrative) (3)

• 2026-06-23 · 因瓶颈和需求激增被重新审视
  이 기술이 다시 한 번 재조명받고 있습니다
  tags: 好观点·好思考 · → daily
• 2026-07-01 · 相比CoWoS-L更合理
  For a chip like Humufish, which appears optimized for inference and agentic workloads, data flow is likely more structured. In that case, EMIB’s approach, placing high-density links only where they are needed, becomes more rational than paying for package-wide routing flexibility.
  tags: 好思考 · → daily
  value: qty= · date=
• 2026-07-01 · 可能标志Intel先进封装突破
  If this report is true, it could mark an important trigger: Intel advanced packaging may be getting closer to clearing its hardest hurdle, landing the first major customer.
  tags: 好思考 · → daily
  value: qty= · date=

立场 (position) (1)

事实 (fact) (12)

• 2026-06-20 · 当前可支持光罩倍数
  That's why EMIB-T already hits 8x reticle today versus CoWoS-L's 5.5x.
  tags: 好数字·好信源 · → daily
  value: qty=8x reticle · date=today
• 2026-05-26 · 在芯片间增加路由通道
  EMIB-T adds routing channels directly through tiny silicon bridges that connect different chips.
  tags: 好思考 · → daily
• 2026-05-26 · 提升 AI 引擎的效率和速度
  By creating a more direct path for both energy and data, EMIB-T increases the efficiency and speed needed to power today’s largest AI engines.
  tags: 好思考 · → daily
• 2026-07-01 · 验证良率
  EMIB-T's 90% validation yield
  tags: 好数字 · → daily
  value: qty=90%
• 2026-07-01 · power gap closure
  EMIB-T closed the power gap by putting TSVs back into the bridge so current runs vertically through it instead of detouring around the substrate, plus MIM caps for noise and copper ground grid for isolation
  tags: 好思考 · → daily
  value: direction=closed via TSVs and MIM caps
• 2026-06-30 · 加入TSV和电容
  EMIB-T sends power vertically straight through the bridge, with added capacitors and a ground plane for cleaner power.
  tags: 好观点 · → daily
  value: qty= · date=
• 2026-06-30 · 制造难度高
  EMIB-T is new, and a power-delivering bridge is harder to manufacture at scale.
  tags: 好观点 · → daily
  value: qty= · date=
• 2026-06-23 · added through-silicon vias to the bridge for much higher power delivery and HBM4-class bandwidth
  Intel added through-silicon vias to the bridge for much higher power delivery and hbm4-class bandwidth. that's the exact limit that cost plain emib the gpu socket last round.
  tags: 好信源 · → daily
• 2026-06-23 · 是更新一代技术
  지금의 EMIB-T가 좀 더 최신 기술입니다
  tags: 好信源 · → daily
• 2026-06-21 · validation yield has reached around 90% and heading to fab this year
  Its validation yield has reached around 90% and it's heading to fab this year.
  tags: 好数字 · → daily
  value: qty=90% · date=this year (2026)
• 2026-06-21 · first product is Jaguar Shores
  the first product (Jaguar Shores) isn't out yet.
  tags: 好信源 · → daily
• 2026-06-21 · pitch scaled from 55µm to 45µm heading toward 35 and 25µm
  The pitch scaled first, from 55µm to 45µm with EMIB-T heading toward 35 and 25µm.
  tags: 好数字 · → daily
  value: qty=55µm to 45µm heading toward 35 and 25µm

时间轴 (近 20)

• 2026-07-01 · narrative · 相比CoWoS-L更合理 · → daily
• 2026-07-01 · narrative · 可能标志Intel先进封装突破 · → daily
• 2026-07-01 · fact · 验证良率 · → daily
• 2026-07-01 · fact · power gap closure · → daily
• 2026-06-30 · fact · 加入TSV和电容 · → daily
• 2026-06-30 · fact · 制造难度高 · → daily
• 2026-06-23 · fact · added through-silicon vias to the bridge for much higher pow · → daily
• 2026-06-23 · fact · 是更新一代技术 · → daily
• 2026-06-23 · narrative · 因瓶颈和需求激增被重新审视 · → daily
• 2026-06-21 · fact · validation yield has reached around 90% and heading to fab t · → daily
• 2026-06-21 · fact · first product is Jaguar Shores · → daily
• 2026-06-21 · fact · pitch scaled from 55µm to 45µm heading toward 35 and 25µm · → daily
• 2026-06-20 · fact · 当前可支持光罩倍数 · → daily
• 2026-05-26 · fact · 在芯片间增加路由通道 · → daily
• 2026-05-26 · fact · 提升 AI 引擎的效率和速度 · → daily
• 2026-05-26 · position · 被视为 AI 硬件规模化所需的封装突破 · → daily

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